First DiiVA Prototypes Debut at CES

Consortium Welcomes New Promoter and Contributors, Makes 1.1 Draft Spec Available For Review

LAS VEGAS — The Digital Interactive Interface for Video & Audio™ (DiiVA™) consortium today announced that Sony Corporation has joined as a Promoter and Nikon and Toshiba as Contributors, adding to the groundswell of industry heavyweights endorsing the DiiVA home entertainment networking standard. Located in CES booth #22025, the world’s first DiiVA-enabled prototypes from brand leaders will be unveiled to key members of the home entertainment ecosystem at the 2010 International CES.

Sony joins the global efforts of fellow DiiVA Promoters Changhong, Haier, Hisense, Konka, Panda, Samsung, Skyworth, SVA, TCL and chip developer, Synerchip as well as Contributors and industry associations in backing the new standard. The DiiVA consortium shares broad support from the Chinese national, regional and local governments in addition to the China Video Industry Association (CVIA) and the China Digital Home Industry Association (CDHIA).

Prototype TVs, Blu-ray players, media receivers and other consumer electronics devices from Promoters and global manufacturers based on DiiVA ICs from Synerchip will showcase DiiVA’s ability to provide consumers not only a premium but also an interactive entertainment experience. DiiVA demos from these providers will be available both in the DiiVA booth and for some at their own CES venues.

DiiVA offers consumers an intuitive and interactive digital entertainment experience by networking their CE, PC and Portable devices with a single, low-cost CAT6-based DiiVA cable that carries the simultaneous transmission of uncompressed video, bi-directional high-speed data and audio, power and power management control packets. For consumers, DiiVA’s features enable:

• Interacting with the TV rather than each individual source device
• Content-based versus connection-based navigation
• Shared Internet and USB host and device access across the DiiVA network
• Integration of mobile and portable devices into the network
• Support for advanced 3D formats and 4K displays

For CE companies, DiiVA’s multi-protocol networking capabilities encourage an open TV platform architecture whereby connected TV’s can become more active participants in next-generation content-distribution business models. Further, DiiVA’s power management capabilities help towards global efforts to reduce the carbon footprint of electronic devices and provide greener solutions by enabling automatic power-down of devices not in use, reducing the overall energy consumption of CE devices on the network.

Commenting on the new standard, Hisense Chairman and CES Keynote Speaker Zhou Houjian said, “DiiVA is the result of revolutionary and collaborative innovation that has roots in China yet demand for its features and applications is universal. We along with our TV manufacturing peers are proud to debut the first prototypes incorporating DiiVA, to demonstrate its benefits to consumers, and to begin efforts to promote DiiVA end-user CE products globally.”

In addition to Nikon and Toshiba, Himax, and Zinwell have joined the ranks of DiiVA Contributors LG Electronics, Panasonic, Sharp Corp., Wanlida (Malata), XOCECO (PRIMA), MediaTek, Tektronix, Foxconn, and JAE to provide important technical input and review to the specification.

The DiiVA Promoters today also released an Informational Version of the 1.1 Draft A DiiVA specification for public review. Companies interested in reviewing the 1.1 Draft A Informational Version or becoming a DiiVA adopter should visit www.diiva.org to request a copy of the Informational Version of the specification and an Adopters Agreement.