Broadcom and Hisense Join Forces to Deliver Wi-Fi Enabled Consumer Electronics to Chinese Market

Companies Unveil Hisense’s First Wi-Fi Enabled Smart TV; Paves Way for Internet TV Adoption in China

LAS VEGAS — 2012 International CES — Broadcom Corporation (NASDAQ: BRCM), a global leader in semiconductor solutions for wired and wireless communications, today announced a collaboration with Hisense, China’s leading TV manufacturer. As part of this joint initiative, Broadcom and Hisense will design and develop Wi-Fi enabled consumer electronics for the Chinese market, including Hisense’s first Smart TV.

The market for Internet TVs worldwide continues to grow substantially, with an estimated 153 percent growth in 2011 alone, according to Market Intelligence & Consulting Institute (MIC), Taiwan. As consumers turn to their TVs for access to the Internet, there’s an increased demand for simplified connectivity between the TV and all their Wi-Fi enabled devices.

By incorporating Broadcom’s leading Wi-Fi technology into Hisense’s new Smart TV, consumers are able to seamlessly transfer data or videos between their TVs and other mobile devices, stream services from the Internet, and download innovative applications for entertainment, business or personal needs.

• The Hisense XT710 Smart TV delivers a sophisticated design, ultra-contrast screen and slim display panel.
• Based on Android, the XT710 comes with thousands of Android Apps and access to Hisense App Shop, a 3D LED, and seamless connectivity to other devices.
• Leveraging Broadcom’s leading Wi-Fi technology, Hisense’s new Smart TV features:
  • 300Mbps data rate and an integrated 2×2 MIMO Wi-Fi module for a quality viewing experience.
  • Multi-screen convergence over Wi-Fi to connect with mobile devices, including mobile phones, tablets and PCs.
  • WiFi Direct to facilitate pairing, setup and IP configuration procedures.
• Hisense’s new Smart TVs are powered by Broadcom’s BCM43235 2×2 2.4 GHz chip.
  • BCM43235 provides best-in-class performance with a highly integrated SoC design.
  • By integrating a variety of components on-chip, Broadcom minimizes the Bill of Materials (BOM) and delivers smaller form factor and lower cost PCB solutions.

Alex Chou Senior Director and General Manger, WLAN China, Broadcom

“Broadcom is committed to collaborating with our partners in China to design disruptive innovations that will transform and improve the wireless connectivity experience. We have built a strong local team dedicated to working hand-in-hand with Hisense to develop innovative products specifically for the China market. This first Hisense Smart TV underscores the power of our collective efforts and is only the first of many key milestones to come.”

Hu Jianyong, Vice General Manager, Hisense Electric Co., Ltd.

“We chose to work with Broadcom due to the company’s unsurpassed leadership in connectivity technology as well as their agility and engineering excellence. As we work toward our mission of bringing our customers the most cutting-edge technologies available, we’re confident that this collaboration with Broadcom will allow us to deliver the high-end solutions that exceed our customer’s needs.”