Broadcom Powers the Connected Digital Home with Industry Leading Silicon Solutions

Sunday, January 6th, 2008 
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New Broadcom® Technology Demonstrations at 2008 International CES Showcase New Levels of Integration and Convergence

LAS VEGAS — 2008 International CES — Broadcom Corporation (Nasdaq: BRCM), a global leader in semiconductors for wired and wireless communications, today announced that it will demonstrate a variety of new silicon, software and reference design platforms at the 2008 International Consumer Electronics Show (CES) in Las Vegas, Nevada from January 7th through January 10th. The Broadcom® technical demonstrations will showcase the convergence of digital video, voice and data to deliver state-of-the-art multimedia experiences to consumers at home, at work and on the go, and will provide an exciting preview of the upcoming consumer products enabled by Broadcom’s innovative technology.

The following is a preview of select new Broadcom consumer technologies that will be featured in the company’s demonstration suite at CES, Meeting Room #35778, South Hall 4 in the Las Vegas Convention Center (LVCC):

Digital Video Technology:

  • Full high definition (HD) 1080p digital TV technology: Broadcom will demonstrate the latest advancements in the company’s HD digital TV products and will also show solutions for capturing audio and video content and for reconciling disparate video and audio content in cable, satellite and IPTV set-top boxes (STBs), home media centers, portable media players, cell phones and a wide range of entertainment devices for the digital home.
  • Digital television home connectivity: Broadcom will demonstrate digital television connectivity based on Broadcom solutions that offer consumers the ability to connect a wide variety of electronics devices — all enabled by Broadcom technology — to accomplish simple but meaningful tasks in a home environment.
  • High definition DVD technology: Broadcom will demonstrate the industry’s most advanced complete system-on-a-chip (SoC) solution that combines both Blu-ray Disc® and HD DVD optical disc formats into a highly integrated, single-chip design. The Broadcom SoC has an advanced feature set, coupled with a Universal Optical Disc software stack and reference platform, that provides OEMs with a complete platform for future generation media players.
  • Client-server HD media streaming set-top box technology: Broadcom will demonstrate client-server reference platforms for DSL/IP networks supporting advanced functionality including the Digital Living Network Alliance® (DLNA®) technology, secure video processor (SVP) and personal video recorder (PVR) “trick mode” capabilities over Ethernet and 802.11n wireless media.
  • Cable set-top box technology: Broadcom will demonstrate its family of cable STB silicon and software reference designs representing industry specifications that support OCAP, multi-stream CableCard, downloadable conditional access (DCAS), DOCSIS® set-top Gateway (DSG), DOCSIS 3.0 downstream channel bonding, and advanced HDTV MPEG-4 video and Dolby® Digital Plus audio decoding capabilities in a client-server network.
  • Advanced satellite STB technology: Broadcom will demonstrate both satellite and hybrid STB reference platforms using advanced modulation technology, DVB-S2. These platforms perform both SD and HD MPEG-2 and AVC decode, and will demonstrate PVR and video-on-demand (VOD) capabilities with VCR “trick mode” effects on various video streams. In addition, the demonstration highlights Broadcom’s advanced 2D and 3D graphics engines that enable Internet browsers and next-generation electronic program guides.
  • Advanced communications technology: Broadcom will demonstrate next generation communications technologies for the xDSL market, including multi-mode VDSL2/ADSL2+ central office and consumer premises solutions that support high definition video, VoIP and 802.11n wireless connectivity.

Mobile and Wireless Networking Solutions:

  • Cellular: Broadcom will demonstrate the world’s first 3G and 2G “mobile-phone-on-a chip” solutions that include advanced baseband processors and all the key components of a cell phone on single 65nm silicon die products.
  • Bluetooth®:Broadcom will showcase new headset solutions as well as multiple advanced Bluetooth combination technologies including WLAN and FM that enable consumer products with new usage models at breakthrough prices and performance levels.
  • GPS: Adding to Broadcom’s already broad wireless portfolio, demonstrations will feature the company’s new highly integrated GPS solutions for personal navigation devices and mobile handsets.
  • Mobile Multimedia: Broadcom will demonstrate its VideoCore® III mobile multimedia processor, the world’s first product enabling low power HD video camcorder and playback over HDMI, together with game console quality 3D graphics and 12 megapixel high resolution digital camera.
  • Cellular RF: Broadcom will demonstrate the world’s first 65nm digital CMOS 2G & 3G cellular RF enabled by innovative architectures that deliver the smallest size and lowest cost bill of materials.
  • Mobile Power Management (PMU): Broadcom will demonstrate industry leading levels of integration, efficiency, and programmable flexibility enables optimized system-level power consumption and lower overall system cost in mobile devices.
  • Wi-Fi/WLAN: Broadcom will demonstrate industry leading 802.11g and 802.11n solutions that push the boundaries of speed and coverage to enable Wi-Fi® users to experience more from their devices.
  • Voice-over-IP (VoIP): Broadcom will highlight new partnerships illustrating how Broadcom’s innovative desktop and mobile IP phones deliver a complete multimedia VoIP experience.