Toshiba's New LCD TV SoC Delivers Single-Chip Solution With Full 1080p High Definition TV Support to North American HDTV Market

Monday, January 7th, 2008

Captures MPEG-2 Decoder, 64-bit MIPS Processor, Dual-Port HDMI Receivers and Dolby Digital Audio in One Chip for Mass-Market HDTVs

SAN JOSE, Calif. — Toshiba America Electronic Components, Inc. (TAEC), a committed leader that collaborates with technology companies to create breakthrough designs, today announced the latest addition to its popular line of system-on-a-chip (SoC) ICs for mass-market ATSC high-definition LCD TVs, the TC90413XBG. This new SoC features a level of integration previously unseen in SoCs intended for use in designing mass market HDTVs for the North American market. The TC90413XBG IC incorporates MPEG-2 HD video and Dolby ® Digital audio decoding, a 64-bit 333 MHz MIPS processor, dual HDMI 1.3 ports and a back-end processor capable of driving both WXGA and 1080p display in one chip. Additionally, the TC90413XBG is available as part of TAEC’s new Customizable Universal DTV Platform (CUDP) for digital television applications, a platform-level solution, which was also announced today, that includes ready-to-manufacture hardware and production software to provide OEMs with a complete HDTV system that is fully customizable to support different international standards and markets.

“High-definition television continues to win over consumers in North America, thanks to the widespread availability of HDTVs at the price points consumers are demanding. Yet the latest technological advancements benefiting the digital TV viewing experience, like watching true 1080p high-definition content from an HD DVD player, have previously only been available to North American customers paying for premium brand HDTVs,” said Shardul Kazi, Technology Executive and vice president of the ASSP Business Unit at TAEC. “Now, TAEC is bringing the benefits of 1080p to mass market HDTVs with products like the TC90413XBG and reference designs like the CUDP. The high level of integration and turnkey characteristics of these TAEC products let OEMs rapidly develop new digital TV solutions with the latest technologies and make them available at consumer-friendly prices.”

The integration made possible by the TC90413XBG can greatly reduce the component count and BOM expenses for next-generation HDTVs, sometimes replacing up to five discrete components with a single chip. Despite the large amount of integration in the device, the TC90413XBG still presents manufacturers with several areas where they can differentiate their HDTV products from the competition, such as customization of graphic user interface (GUI), remote control functionality, LCD panel and support for multiple tuners.

Key Features of the TC90413XBG Digital TV SoC

Highlight features of the TC90413XBG include:

  • Integrated VSB/QAM demodulator
  • 333 MHz, 64-bit MIPS CPU
  • MPEG-2 transport, MPEG-2 video and AC-3 audio decoder
  • Video ADCs and 3D YCS decoder for analog video output
  • I2S audio input and output
  • Dual HDMI 1.3 ports with deep color support
  • 16-bit DDR-2 800 MHz memory interface
  • Integrated backend video processor for both WXGA and 1080p display
  • 456-pin PBGA packaging

Pricing and Availability

The TC90413XBG is available now in sample quantities, with full production scheduled for late Q1/early Q2 2008. The SoC is priced at $25 per unit in large unit quantities.