Socionext develops small, low power 4K/60p HEVC codec

Tuesday, April 11th, 2017
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New SC2M50 Designed for a Wide Range of High Image Quality Data Processing Needs for Professional Audio and Video Applications

SUNNYVALE, Calif. — Socionext Inc., an emerging leader in advanced SoC based video and imaging solutions, today introduced the SC2M50, a new HEVC / H.265 Codec IC. Sample shipments will start in May 2017. Socionext will demonstrate the SC2M50 at the NAB show in Las Vegas, April 24-27, at booth SU13712 in the South Hall’s upper level.

SC2M50 Block Diagram

Socionext delivered the world’s first 4K/60p HEVC real-time video encoder, the MB86M31 and the HEVC / H.264 / MPEG Multi-format codec MB86M30, for high-end video transmission equipment. Built on the engineering expertise gained from these new products, Socionext has successfully implemented a high-image quality HEVC codec functionality into a small 25mm x 25mm package. The low power device consumes only 3.5W, which allows the IC to be utilized in battery-operated equipment. The SC2M50 supports 4K/60p video and 4:2:2 format, 10-bit input / output, which has excellent color reproducibility, making it suitable to cover a wide range of needs for professional video equipment, including portable devices. Samples come in May, with volume shipping in October 2017.

Socionext’s partners are developing codec devices equipped with the SC2M50. At the NAB show in Las Vegas April 24-27, Socionext will have demonstrations of 4K video encoding and decoding using the latest codec devices.

SC2M50 Device

Main specifications of SC2M50 include the following:

Video encoding HEVC Main, Main10, Format Range Extensions
(4:2:2 / 4:2:0, 8/10bit, up to 4K 60p)
Video decoding HEVC Main, Main10, Format Range Extensions
(4:2:2 / 4:2:0, 8/10bit, up to 4K 60p)
Stream input / output TS input x 1
TS output x 1
Video input / output 20bit Parallel I/F input x 4, output x 4
YUV 4:2:2 10bit up to 4K 60p
SMPTE-435(Square Division),
SMPTE ST2036-3 (2-Sample Interleave Division),
SMPTE 424M (3G-SDI),
Audio input / output I2S x 2
Peripheral interface PCI express Gen 2.0 (4 lanes, Max payload size 512 byte)
USB 2.0 Device x 1
UART x 4
I2C x 3
SPI x 2
GPIO x 64
Memory interface Serial flash interface HSSPI x 1
LPDDR4 2400Mbps 16bits x 6 (maximum)
Image processing Video overlay (option)
Technology 28nm Process / 1,361 pin FCBGA 25mm x 25mm
Power Consumption 3.5W (Typical)