Broadcom Announces First Dual ISDB-T Chipset for Digital Terrestrial TV in Latin America

Monday, July 30th, 2012
|
Broadcom logo

  • Broadcom’s Digital Terrestrial TV chipset offers a new level of integration to burgeoning ISDB-T markets in Latin America; DTT households in Latin America are expected to grow 400% by 2017*
  • Hybrid TV services offer linear and advanced TV content and services when interfaced with a range of Broadcom set-top box system-on-a-chip (SoC) platforms

SAO PAULO — ABTA — Broadcom Corporation (NASDAQ: BRCM), a global innovation leader in semiconductor solutions for wired and wireless communications, today announced the BCM3472, the industry’s first fully integrated 40nm Dual ISDB-T receiver chipset. Addressing the growing popularity of digital TV in Latin America, Broadcom is driving the deployment of digital terrestrial TV (DTT) services in Brazil and a range of emerging markets around the world.

The new chip can be combined with Broadcom set-top box SoCs to launch Hybrid TV – digital terrestrial broadcast combined with advanced pay TV services. This enables operators to offer subscribers linear TV while adding new, advanced services like Digital Video Recorder (DVR) and Video on Demand (VoD). By supporting Dual ISDB-T Receivers, Broadcom’s solution is ideal for Hybrid STB and DVR solutions where multiple tuners must be included in the platform. The BCM3472’s 12mm x 12mm package enables device manufacturers to save space and cost over existing solutions.

Additional Product Features

  • Integrates two receivers that include low-noise amplifiers (LNAs) with a tuner and demodulator on a single-chip that enables better cost and design efficiencies.
    • RF loop through, daisy chain and clock sharing that eliminates the need for multiple crystals in a multi-tuner design
  • Broadcom’s BCM3471 40nm Single ISDB-T device features an LNA, tuner and demodulator on a single-chip.

Availability

Broadcom’s BCM3472 and BCM3471 chips are currently sampling and will be shipping in mass production at the end of Q1 2013.