Newport Media Begins Mass Production Shipments of Dual Mode Digital/Analog TV IC

Wednesday, January 5th, 2011
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Newport Media’s NMI625 Provides Dual Mode ISDB-T / Analog TV Operation in Samsung Galaxy Tablet

LAS VEGAS — 2011 International CES — Newport Media, an innovative fabless communications semiconductor company supplying products to the broadcast media industry, announced that its NMI625 dual mode ISDB-T / Analog TV IC has begun shipping in mass production and is currently available to consumers in Latin America powering the TV operation of Samsung’s Galaxy Tab.

As ISDB-T Digital Television continues its expansion in Brazil and throughout Latin America there is significant need for cellular handsets, smartphones and tablets that are capable of receiving the latest digital transmissions in large urban areas, where such broadcasts are commonplace, while still being able to receive existing Analog TV broadcasts in areas that have yet to be upgraded to digital TV service.

With the industry’s broadest portfolio of Mobile TV SoCs, Newport Media’s NMI625 device is the first in the world to combine all required RF, baseband and memory functions for ISDB-T and Analog TV in a single IC.

“Newport Media is very excited about the market for dual mode ISDB-T with Analog TV for Latin America and the business prospects for our dual mode products,” said Mohy Abdelgany, president and chief executive officer for Newport Media. “NMI expects dual mode operation to become the norm in Latin America and being able to introduce this capability into the marketplace via a revolutionary product like Samsung’s Galaxy Tab is a significant accomplishment.”

Newport Media supplies a comprehensive portfolio of best-in-class SoC products addressing the world’s major Mobile Digital Television (Mobile DTV) standards as well as existing analog TV systems throughout the globe.

The NMI625 is available in sample quantities and is priced at $8 per unit in OEM quantities of 10,000. The device is manufactured using low-cost, 65 nanometer complementary metal-oxide semiconductor (CMOS) process technology and packaged in conventional fine pitch plastic ball grid array (BGA) package and is currently in high volume mass production.