Broadcom Demonstrates Industry Leading Technologies for Next Generation Mobile Devices at 2008 Mobile World Congress

Broadcom to Demonstrate HSUPA on Breakthrough ‘3G Phone-on-a-Chip’ Processor, New GPS Product Offering and Its Technology Leadership Portfolio Including Mobile Multimedia, Wi-Fi, Bluetooth, Mobile TV, RF and Power Management

IRVINE, Calif. — Broadcom Corporation (Nasdaq: BRCM), a global leader in semiconductors for wired and wireless communications, will demonstrate its innovative and leading portfolio of complete system-on-a-chip (SoC) solutions for mobile devices at the 2008 Mobile World Congress trade show in Barcelona, Spain, from February 11th through February 14th.

Broadcom® mobile and wireless technologies enable manufacturers to develop leading-edge mobile devices and end-to-end wireless connectivity solutions for the home, business and mobile markets. Addressing every major wireless market segment, Broadcom features products for wireless local area networking, cellular and wide area networking, and personal area networking, as well as a comprehensive range of mobile technologies, including advanced GPS solutions. The company’s portfolio of mobile and wireless products is enabling a new generation of portable devices including cellular handsets, personal navigation devices, gaming platforms and other wireless-enabled consumer electronics and peripherals, such as home gateways, printers, VoIP phones, home entertainment systems and notebook computers.

With a host of “industry first” products recently introduced, Broadcom addresses the key technological requirements of evolving mobile handset and portable multimedia devices, and has established itself as a technology leader in the handset market. Broadcom’s leading product line features the most integrated “phone-on-a-chip” solutions, including 2G and 3G processors with built-in RF and multimedia, as well as the most advanced mobile multimedia processor available, capable of enabling HD-quality video capture and playback on cell phones.

The company also offers the most flexible smartphone platform in the industry, supporting all of the major open operating systems and including the processing power and high levels of integration required to develop more affordable, highly functional smartphone products. Broadcom demonstrations will also include the company’s all-COMS GPS solutions, which feature leading levels of chip integration and RF sensitivity.

Highlighting the company’s strength and leadership as a technological powerhouse for mobile devices, the following technologies and products will be demonstrated at the 2008 Mobile World Congress in Barcelona:

• Broadcom’s new BCM21551 single-chip 3G SoC processor with HSUPA functionality for high bandwidth transfers of data to mobile devices. The new baseband solution enables manufacturers to build next generation 3G smartphones with breakthrough features, sleek form factors and extended battery life. Broadcom will also be demonstrating the BCM21331 single-chip 2G SoC, enabling a range of cost effect new handset devices.
• GPS demonstrations showcasing the company’s first highly integrated GPS solution for personal navigation devices and mobile handsets. The new BCM4750 GPS receiver sets new standards in performance and power consumption, using less than half the power of competitive solutions.
• Mobile multimedia demonstrations featuring Broadcom’s new VideoCore® III mobile multimedia technology. The BCM2727 is the world’s first low power multimedia processor that enables high definition video camcorder and playback in cell phones and portable media players. It features game console-quality 3D graphics, up to 12 megapixel high resolution digital image processing, and expensive components required for ISP subsystem implementation.
• Mobile TV demonstrations include the newly announced BCM2940 and BCM2930 platforms, introducing superior radio receive performance and ultra low power consumption to enable Digital Video Broadcast services in phone handsets and other mobile devices.
• Bluetooth® and Wi-Fi® demonstrations including multiple advanced combination technology products such as the BCM2048 (which includes Bluetooth and FM tuner) and the BCM4325 (which combines Bluetooth, Wi- Fi and FM radio functionality and was recently selected as a finalist for EDN Magazine’s “Innovation Awards”). These products enable new usage models for a variety of consumer products, with breakthrough pricing and performance levels. Broadcom will also be demonstrating groundbreaking Bluetooth audio technology, including the BCM2044 and BCM2047 headset chips, as well as the company’s SmartAudio™ technology that significantly improves audio clarity over Bluetooth.
• Cellular RF demonstrations featuring the world’s first 65 nanometer digital CMOS 2G and 3G cellular RF single-chip solutions, which are enabled by Broadcom’s innovative architectures, delivering the smallest size and lowest bill of materials (BOM) cost.
• Mobile power management unit (PMU) demonstrations featuring the BCM59001 and BCM59035 show Broadcom’s industry leading levels of integration, efficiency and programmability that provide optimized system-level power consumption and lower overall system cost in mobile devices.
• Most new products demonstrated by Broadcom feature the 65 nanometer process geometry (the most advanced lithographic node for manufacturing semiconductors in large volumes today). 65nm provides significant benefits over 90nm and 130nm processes by enabling lower power consumption, smaller size and higher levels of integration.