Digital TV News: TAEC

Consumer Electronics Leaders Showcase MIPS-Based™ Products at CES 2008
Jan 17, 2008 – MIPS Technologies (NasdaqGS: MIPS) has announced that a broad array of the world's leading consumer electronics companies debuted and demonstrated design innovations based on the industry-leading MIPS® architecture at last week's Consumer Electronics Show (CES) in Las Vegas.
News categories: MIPS Technologies, CES2024, DVR, Semiconductor, Set Top Box, Silicon IP, Smart Home, Smart TV, Tablet

Toshiba Launches Turnkey Digital TV Platform Addressing the Requirements of the Global Marketplace
Jan 7, 2008 – Toshiba America Electronic Components, Inc. (TAEC) has unveiled its unified platform solution for the global digital television (DTV) market.
News categories: Toshiba America Electronic Components, ATSC 3, CES2024, Digital TV, Middleware, Semiconductor, Smart TV

Toshiba's New LCD TV SoC Delivers Single-Chip Solution With Full 1080p High Definition TV Support to North American HDTV Market
Jan 7, 2008 – Toshiba America Electronic Components, Inc. (TAEC) has announced the latest addition to its popular line of system-on-a-chip (SoC) ICs for mass-market ATSC high-definition LCD TVs, the TC90413XBG.
News categories: Toshiba America Electronic Components, ATSC 3, CES2024, Digital TV, ICs, Semiconductor, Smart TV, Terrestrial, USA

New Toshiba DTV Solution Raises Frame Rates To Deliver Blur-Free High-Definition Video
Sep 4, 2007 – Toshiba America Electronic Components (TAEC) has announced the latest addition to its portfolio of digital TV (DTV) semiconductor solutions. The TC90240XBG device integrates a scan rate converter to upgrade standard 60 Hz signals to 120 Hz, greatly improving the blurry motion sometimes seen during fast-paced action scenes in high-definition content.
News categories: TAEC, ICs, Semiconductor, Smart TV