Semiconductor (ICs, silicon IP, microchips, …) News

NeoMagic® Corporation to Present Latest Products at Mobile World Congress in Barcelona, Spain
Feb 7, 2008 – NeoMagic (Nasdaq: NMGC) has announced that it will demonstrate Mobile TV solutions for ISDB-T and T-DMB with its MiMagic or NeoMobileTV multimedia processors, at next week's Mobile World Congress in Barcelona (February 11-14, 2008).
News categories: NeoMagic, ISDB-T, Mobile, MWC24, Semiconductor

Freescale Demonstrating End-to-End LTE Cellular Technologies
Feb 7, 2008 – Freescale Semiconductor will be demonstrating working LTE technology in both its handset and network platforms. This technology will be on display at Mobile World Congress in Barcelona, Spain, February 11-14, 2008.
News categories: Freescale, 5G, Broadband, Content Distribution, Mobile, MWC24, Semiconductor

Microtune Announces Fourth Quarter and Year 2007 Financial Information
Feb 7, 2008 – Microtune's (NASDAQ: TUNE) net revenue for the quarter ended December 31, 2007 grew by 37% to $22.8 million compared to the fourth quarter of 2006. Through December 31, 2007, Microtune has shipped a cumulative historical total of 81.4 million silicon TV tuner chips.
News categories: Microtune, Earnings Release, Digital TV, Results, Semiconductor

The Worldwide Digital Terrestrial Television Receiver Market Will Reach 350 Million Units in 2013, According to ABI Research
Feb 6, 2008 – The worldwide DTT (Digital Terrestrial Television) receiver market will grow from 65 million units in 2007 to more than 350 million units in 2013, representing a compound annual growth rate of 32%.
News categories: ABI Research, ATSC 3, Digital TV, DTMB, ISDB-T, Market Research, Semiconductor, Set Top Box, Smart TV, Tablet, Terrestrial

CEVA Expands its Multimedia Platform Offering with Addition of RealVideo and VC-1 Video Standards
Feb 6, 2008 – CEVA [(NASDAQ: CEVA); (LSE: CVA)] has announced the addition of RealVideo® and VC-1 software components for its MM2000™ programmable mobile multimedia platform.
News categories: CEVA, Mobile, MWC24, Semiconductor, Silicon IP

Siano Launches 2nd Generation Micro Antenna Chip for Mobile TV
Feb 6, 2008 – Siano Mobile Silicon has announced the launch of its second-generation antenna-chip product, labeled the SMS8022, designed for high-performing mobile applications.
News categories: Siano Mobile Silicon, Vishay, Digital TV, Mobile, MWC24, Semiconductor

Toshiba combines CMOS ASIC and eDRAM technologies to support rapid development of SIDSA mobile TV chipset
Feb 5, 2008 – Toshiba Electronics Europe (TEE) has announced that the company's renowned CMOS ASIC process and Embedded DRAM (eDRAM) technology have played a key role in the development of a next generation system on chip (SoC) DVB-H IC from SIDSA.
News categories: Toshiba Electronics, SIDSA, Mobile, Semiconductor, Silicon IP

VIACCESS, 27M Technologies and NEC Electronics reduce time to market of Pay TV set top box designs
Feb 5, 2008 – Viaccess, 27M Technologies and NEC Electronics have announced the availability of a manufacturer's kit based on NEC's EMMA2SL and EMMA2SL/P MPEG2 decoders, drastically reducing the time to market of STBs which incorporate Viaccess CA technology.
News categories: 27M Technologies, Viaccess, NEC Electronics, Jan Mårtensson, François Moreau de Saint-Martin, Daniel Tannière, Conditional Access, Digital TV, Middleware, Semiconductor, Set Top Box

Broadcom Demonstrates Industry Leading Technologies for Next Generation Mobile Devices at 2008 Mobile World Congress
Feb 5, 2008 – Broadcom (Nasdaq: BRCM) will demonstrate its innovative and leading portfolio of complete system-on-a-chip (SoC) solutions for mobile devices at the 2008 Mobile World Congress trade show in Barcelona, Spain, from February 11th through February 14th.
News categories: Broadcom, 5G, Mobile, MWC24, Semiconductor